Manufacturing Processes II Practice Test 4

1. The Carrier gas should spread more after discharge.

2. AJMM is widely used for machining of glass and silicon.

3. In AJMM, material removal starts when the fracture strength is reached.

4. There is appearance of the dimples during AJM.

5. Holes up to _____ deep can be drilled without using AJM process.

6. At high aspect ratio, silicon nanowires tend to form bundles.

7. AJM applications include drilling, engraving of glass, etc. operations.

8. This method is used for _____

9. Lithographic approach along with noble metal is used to produce highly ordered pores.

10. Metal assisted etching of silicon is dependent on the orientation of silicon atoms in the structure.